COB high-density implementation problem solving
Leave the implementation challenges to us! We will propose solutions with our unique design and know-how.
We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.
- Company：イデアシステム
- Price：Other
